AlN (Aluminum Nitride)
AlN is a material with high electric insulation and low dielectric constant.
Mg-SiC (Magnesium-Silicon Carbide)
Standard materials are light-weighted and have a low coefficient of thermal expansion, 7.0 ppm, and high thermal conductivity, 230 W/(m・K).
Al-SiC (Sintered Aluminum-Silicon Carbide)
Sintered Al-SiC is a heatspreader which can be processed in relatively complex shape such as “lid shape”. The specific gravity is 1/3 of Copper (Cu).
Metal Foam "Celmet™"
Celmet™ is a metal foam in which triangular-prism-shaped cells are interconnected to form a three-dimensional structure having continuous pores. The products are available as nickel and nickel-chrome alloy materials.