Heatspreaders for Semiconductor laser submount, power transistor substrate

Cu-Diamond (DMCH) is a composite material of diamond and Copper. Although it has thermal expansion coefficient close to that of compound semiconductor material (GaAs and GaN), it has thermal conductivity higher than that of Copper. It allows the forming of various metallizing thin films for chip mounting and wire bonding.

Material Trade Name Features Coefficient of Average Linear Thermal Expansion
Thermal conductivity R.T.[W/(m・K)]
Cu-Diamond DC60 The heatspreader with high thermal conductivity has coefficient of thermal expansion suitable for compound semiconductors (GaAs, GaN). 6.0 550
DC70 6.5 500

For more detailed information about Cu-Diamond