Heatspreaders for Wireless communication, Opto electronics, in-vehicle

Cu-Mo is available with rolling and stamping processes. The thermal expansion and thermal conductivity are adjustable. In addition, it has excellent initial heat dissipation effect on the surface because the surface, the laminated material CPC, is pure Copper. We offer 10 types of Cu-Mo (CM-15, PCM30, PCM35, PCM40, RCM60, CPC141, CPC232, CPC111, CPC212, CPC-300) according to customer needs.

close
Material Trade Name Composition Features Coefficient of Average Linear Thermal Expansion
R.T.~800℃ [ppm/K]
Thermal conductivity R.T.[W/(m・K)]
Cu-Mo CM-15 85Mo-15Cu This Cu-Mo has a low coefficient of thermal expansion, and has the close coefficient to GaAs and GaN. And, it prevents mismatches in thermal expansion. 7.6 148
PCM30 70Mo-30Cu This material keeps thermal expansion low, and can be manufactured by cost-effective manufacturing processes such as rolling and stamping. 7.5 195
PCM35 65Mo-35Cu This has the same coefficient of thermal expansion as that of alumina, widely used for ceramic package using alumina. 7.8 210
PCM40 60Mo-40Cu As its thermal expansion coefficient is intermediate value between the devices (Si, GaAs, GaN, SiC) and copper or aluminum, it is widely used as a stress cushioning material in case devices are mounted on a copper or aluminum plate. 8.2 220
RCM60 40Mo-60Cu As its thermal expansion coefficient is intermediate value between the devices (Si, GaAs, GaN, SiC) and copper or aluminum, it is widely used as a stress cushioning material when devices are mounted on a copper or aluminum plate. 10.5 275

For more detailed information about Cu-Mo

LINK