Submounts (heatspreaders) for semiconductor lasers or LED substrates

AlN is a material with high electric insulation and low dielectric constant. On the surface, it is possible to form various metallizing thin films for electric circuits, chip mounting, and wire bonding.

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Material Trade Name /
Composition
Features Coefficient of Average Linear Thermal Expansion
R.T.~400℃[ppm/K]
Thermal conductivity R.T.[W/(m・K)]
AlN AlN(200W) It is useful when insulation and patterns are required. 4.5 >200
AlN(170W) 4.5 >170

For more detailed information about AlN

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