Cu-Mo (Copper-Molybdenum)
Heatspreaders for Wireless communication, Opto electronics, in-vehicle
Cu-Mo is available with rolling and stamping processes. The thermal expansion and thermal conductivity are adjustable. In addition, it has excellent initial heat dissipation effect on the surface because the surface, the laminated material CPC, is pure Copper. We offer 10 types of Cu-Mo (CM-15, PCM30, PCM35, PCM40, RCM60, CPC141, CPC232, CPC111, CPC212, CPC-300) according to customer needs.
| Material | Trade Name | Composition | Features | Coefficient of Average Linear Thermal Expansion R.T.～800℃ [ppm/K] |
Thermal conductivity R.T.［Ｗ/(ｍ・K)］ |
|---|---|---|---|---|---|
| Cu-Mo | CM-15 | 85Mo-15Cu | This Cu-Mo has a low coefficient of thermal expansion, and has the close coefficient to GaAs and GaN. And, it prevents mismatches in thermal expansion. | 7.6 | 148 |
| PCM30 | 70Mo-30Cu | This material keeps thermal expansion low, and can be manufactured by cost-effective manufacturing processes such as rolling and stamping. | 7.5 | 195 | |
| PCM35 | 65Mo-35Cu | This has the same coefficient of thermal expansion as that of alumina, widely used for ceramic package using alumina. | 7.8 | 210 | |
| PCM40 | 60Mo-40Cu | As its thermal expansion coefficient is intermediate value between the devices (Si, GaAs, GaN, SiC) and copper or aluminum, it is widely used as a stress cushioning material in case devices are mounted on a copper or aluminum plate. | 8.2 | 220 | |
| RCM60 | 40Mo-60Cu | As its thermal expansion coefficient is intermediate value between the devices (Si, GaAs, GaN, SiC) and copper or aluminum, it is widely used as a stress cushioning material when devices are mounted on a copper or aluminum plate. | 10.5 | 275 |